Title:
ACTIVE ENERGY RAY CURING RESIN COMPOSITION, METHOD FOR MANUFACTURING SAME, AND SEAL MATERIAL USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/099864
Kind Code:
A1
Abstract:
Provided is an active energy ray curing resin composition for seal-material use that has high geometrical precision, has outstanding productivity, and is favorable for use in a bead-shaped seal material. In this active energy ray curing resin composition for seal-material use, at least 0.1-25 parts by weight of a thixotropy-imparting agent (B) is dispersed in 100 parts by weight of an active energy ray curing resin (A), the apparent viscosity (compliant with JIS Z8803, cone/plate rotating viscometer, 40°C) of the active energy ray curing resin composition in an uncured state is 50-5000 Pa∙s in the 0.1-10/sec shear velocity range, the thixotropic factor as determined on the basis of the apparent viscosity in the shear velocity range is 1.1-10, the thixotropy-imparting agent (B) is silica microparticles, and the particle size distribution of the silica microparticles in the active energy ray curing resin (A) has a plurality of peaks.
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Inventors:
NAGATA SHINICHIRO (JP)
AZUMA SHUNICHI (JP)
SASAZAWA TAKAHIRO (JP)
AZUMA SHUNICHI (JP)
SASAZAWA TAKAHIRO (JP)
Application Number:
PCT/JP2012/083464
Publication Date:
July 04, 2013
Filing Date:
December 25, 2012
Export Citation:
Assignee:
TAICA CORP (JP)
International Classes:
C08F299/00; C09K3/10; C08J3/24; C08K3/36; C08L101/00; F16J15/14
Domestic Patent References:
WO2010142872A1 | 2010-12-16 |
Foreign References:
JP2003105320A | 2003-04-09 | |||
JP2009090231A | 2009-04-30 | |||
JP2008013429A | 2008-01-24 | |||
JPH06157857A | 1994-06-07 | |||
JP2008094902A | 2008-04-24 | |||
JPH0788430A | 1995-04-04 | |||
JP2004289943A | 2004-10-14 | |||
JP2003105320A | 2003-04-09 | |||
JP2001182836A | 2001-07-06 | |||
JP2003120819A | 2003-04-23 |
Other References:
See also references of EP 2799510A4
Attorney, Agent or Firm:
YOSHIDA, Yoshiharu et al. (JP)
Yoshiharu Yoshida (JP)
Yoshiharu Yoshida (JP)
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Claims: