Title:
ACTIVE ESTER RESIN COMPOSITION AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2018/008411
Kind Code:
A1
Abstract:
Provided are: an active ester resin composition which has low shrinkage ratio during the time of curing, and which forms a cured product that has low elastic modulus at high temperatures; a curable resin composition which contains this active ester resin composition; a cured product of this curable resin composition; a printed wiring board; and a semiconductor sealing material. An active ester resin composition which is characterized by containing (A) an active ester compound that is an esterified product of (a1) a naphthol compound and (a2) an aromatic polycarboxylic acid or an acid halide thereof, and (B) an active ester resin that uses, as essential reactive starting materials, (b1) a compound having one phenolic hydroxyl group, (b2) a compound having two or more phenolic hydroxyl groups and (b3) an aromatic polycarboxylic acid or an acid halide thereof. This active ester resin composition is also characterized in that the content of the active ester compound (A) is 40% or more.
Inventors:
KAWASAKI AKITO (JP)
SATOU YUTAKA (JP)
OKAMOTO TATSUYA (JP)
SATOU YUTAKA (JP)
OKAMOTO TATSUYA (JP)
Application Number:
PCT/JP2017/022997
Publication Date:
January 11, 2018
Filing Date:
June 22, 2017
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/02; C08G63/133; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
| WO2016098488A1 | 2016-06-23 |
Foreign References:
| JP2009242560A | 2009-10-22 | |||
| JP2004155990A | 2004-06-03 | |||
| JP2009235165A | 2009-10-15 |
Attorney, Agent or Firm:
KONO Michihiro (JP)
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