Title:
ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/168252
Kind Code:
A1
Abstract:
Provided are: an active light sensitive or radiation sensitive resin composition, from which a pattern having low line width roughness (LWR) is formed; a resist film which uses this active light sensitive or radiation sensitive resin composition; a pattern forming method; and a method for producing an electronic device. This active light sensitive or radiation sensitive resin composition contains a compound which generates an acid represented by general formula (I) when irradiated with active light or radiation.
Inventors:
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
ASAKAWA DAISUKE (JP)
SAKITA KYOHEI (JP)
GOTO AKIYOSHI (JP)
ASAKAWA DAISUKE (JP)
SAKITA KYOHEI (JP)
Application Number:
PCT/JP2018/003737
Publication Date:
September 20, 2018
Filing Date:
February 05, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C09K3/00; G03F7/038; G03F7/039; G03F7/20; C07C309/07; C07C309/17; C07C381/00
Domestic Patent References:
| WO2011030737A1 | 2011-03-17 |
Foreign References:
| JP2014126767A | 2014-07-07 | |||
| JPH1010715A | 1998-01-16 | |||
| JP2012194292A | 2012-10-11 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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