ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD AND METHOD FOR PRODUCING ELECTRONIC DEVICE

WIPO Patent Application WO/2019/044547

A1

Provided is an active light sensitive or radiation sensitive resin composition which enables the formation of a pattern having excellent resolution and shape characteristics even if used in thick film applications. Also provided are: a resist film which uses this active light sensitive or radiation sensitive resin composition; a pattern forming method; and a method for producing an electronic device. An active light sensitive or radiation sensitive resin composition according to the present invention is a negative composition that is used for the formation of a pattern having a film thickness of 1 μm or more, and contains at least one acid generator which is selected from the group consisting of compounds represented by general formula (ZI-3) and compounds represented by general formula (ZI-4), a crosslinking agent, a resin which contains a reactive group that is reactive with the crosslinking agent, and at least one resin which is selected from the group consisting of resins having a structure wherein a reactive group is protected by a leaving group that is decomposed and separated by the action of an acid.

YONEKUTA YASUNORI (JP)
HATAKEYAMA NAOYA (JP)
YOSHIMURA TSUTOMU (JP)
HIGASHI KOHEI (JP)

PCT/JP2018/030541

March 07, 2019

August 17, 2018

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FUJIFILM CORP (JP)

G03F7/004; C08F12/24; G03F7/038; G03F7/20

JP2009198962A	2009-09-03
JP2003162060A	2003-06-06
JP2005326580A	2005-11-24

NAKASHIMA Junko et al. (JP)

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