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Title:
ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD, PHOTOMASK, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2020/045535
Kind Code:
A1
Abstract:
The present invention provides: an active light sensitive or radiation sensitive resin composition that contains (A) a compound which generates an acid when irradiated with active light or radiation, and which has a specific structure; an active light sensitive or radiation sensitive film which uses this active light sensitive or radiation sensitive resin composition; a pattern forming method; a photomask; a method for producing an electronic device; and a compound.

Inventors:
FUKUZAKI EIJI (JP)
MIYOSHI TARO (JP)
YONEKUTA YASUNORI (JP)
TAKAHASHI TOSHIYA (JP)
ISHIHARA HIDEYUKI (JP)
Application Number:
PCT/JP2019/033803
Publication Date:
March 05, 2020
Filing Date:
August 28, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C07C309/58; C07C381/12; G03F7/039; G03F7/20
Foreign References:
JP2009053518A2009-03-12
JP2013160955A2013-08-19
JP2014219680A2014-11-20
JP2006227331A2006-08-31
JP5311673B22013-10-09
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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