Title:
ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/251055
Kind Code:
A1
Abstract:
One problem addressed by the present invention is to provide an active light-sensitive or radiation-sensitive resin composition that has excellent resolution and can form a pattern in which defects are inhibited. Another problem addressed by the present invention is to provide a resist film, a pattern formation method, and an electronic device manufacturing method related to the active light-sensitive or radiation-sensitive resin composition. An active light-sensitive or radiation-sensitive resin composition according to the present invention contains: a resin that decomposes due to the action of an acid and thereby increases in polarity; and a compound that generates an acid when irradiated with active light or radiation, wherein the resin that decomposes due to the action of an acid and thereby increases in polarity includes one or more selected from the group consisting of the repeating units represented by formulas (1) to (5), and the compound that generates an acid when irradiated with active light or radiation contains compound (I) and/or (II).
Inventors:
YOSHIMURA TSUTOMU (JP)
KOJIMA MASAFUMI (JP)
KOJIMA MASAFUMI (JP)
Application Number:
PCT/JP2021/018194
Publication Date:
December 16, 2021
Filing Date:
May 13, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F220/20; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
| WO2020054275A1 | 2020-03-19 |
Foreign References:
| JP2014149409A | 2014-08-21 | |||
| JP2015024989A | 2015-02-05 | |||
| JP2014035413A | 2014-02-24 | |||
| JP2013235115A | 2013-11-21 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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