Title:
ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/008345
Kind Code:
A1
Abstract:
The present invention provides: an active light sensitive or radiation sensitive resin composition which contains a compound (I) that produces an acid when irradiated with active light or radiation, while having an ionic structure and a zwitter ionic structure; an active light sensitive or radiation sensitive film which uses this active light sensitive or radiation sensitive resin composition; a pattern forming method; a method for producing an electronic device; and a compound.
Inventors:
KAWABATA TAKESHI (JP)
UEMURA MINORU (JP)
TSUCHIMURA TOMOTAKA (JP)
UEMURA MINORU (JP)
TSUCHIMURA TOMOTAKA (JP)
Application Number:
PCT/JP2022/028539
Publication Date:
February 02, 2023
Filing Date:
July 22, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C07C25/18; C07C43/225; C07C309/10; C07C311/48; C07C311/53; C07C381/12; C07D295/26; C07D327/06; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
| WO2020158366A1 | 2020-08-06 |
Foreign References:
| JP2019202991A | 2019-11-28 | |||
| JP2021038204A | 2021-03-11 | |||
| JP2016222549A | 2016-12-28 | |||
| JP2019014704A | 2019-01-31 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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