Title:
ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/145488
Kind Code:
A1
Abstract:
The present invention provides: an active light sensitive or radiation sensitive resin composition which contains a resin (A) that contains a group which is decomposed by the action of an acid, thereby increasing the polarity, wherein the resin (A) contains an acid-decomposable repeating unit which has a specific structure containing an aromatic heterocyclic group that contains a sulfur atom; a resist film which uses this active light sensitive or radiation sensitive resin composition; a method for forming a pattern; and a method for producing an electronic device.
Inventors:
YAMAGUCHI SHUHEI (JP)
FUKUZAKI EIJI (JP)
FUKUZAKI EIJI (JP)
Application Number:
PCT/JP2023/000792
Publication Date:
August 03, 2023
Filing Date:
January 13, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; G03F7/004; G03F7/038; G03F7/20
Foreign References:
| JP2008065114A | 2008-03-21 | |||
| JP2006251466A | 2006-09-21 |
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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