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Patent Searching and Data


Title:
ACTIVE METAL BRAZING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2012/161148
Kind Code:
A1
Abstract:
The present invention is an active metal brazing material that is composed of an Ag-Cu-Ti-Sn alloy, which contains 20-40% by weight of Cu, 1.0-3.0% by weight of Ti and 1.2-6.0% by weight of Sn with the balance made up of Ag, and that has a metal structure wherein an Sn-Ti intermetallic compound or a Cu-Ti intermetallic compound is dispersed in an Ag-Cu alloy matrix. The weight ratio of Sn to Ti, namely Sn/Ti is 1.2 or more, and the intermetallic compound has a particle diameter of 20 μm or less. This active metal brazing material improves the workability of conventionally known Ag-Cu-Ti alloy active metal brazing materials, and enables working in micro dimensions at high working rate. This active metal brazing material can be produced by performing plastic working at a working rate of 90% or more after melting/casting the Ag-Cu-Ti-Sn alloy having the above-described composition, thereby miniaturizing the intermetallic compound.

Inventors:
KISHIMOTO TAKAOMI (JP)
KASHIWAGI KOUZOU (JP)
SAKAGUCHI OSAMU (JP)
Application Number:
PCT/JP2012/062890
Publication Date:
November 29, 2012
Filing Date:
May 21, 2012
Export Citation:
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Assignee:
TANAKA PRECIOUS METAL IND (JP)
KISHIMOTO TAKAOMI (JP)
KASHIWAGI KOUZOU (JP)
SAKAGUCHI OSAMU (JP)
International Classes:
B23K35/30; B23K35/40; C04B37/00; C04B37/02; C22C5/06; C22F1/14; C22F1/00
Domestic Patent References:
WO2005007596A12005-01-27
Foreign References:
JPH08310876A1996-11-26
JPS6182995A1986-04-26
JP2002292490A2002-10-08
JPH10236886A1998-09-08
JPH0716789A1995-01-20
Other References:
See also references of EP 2716402A4
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
Patent business corporation Tanaka and Okazaki and associates (JP)
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Claims: