ACTIVE LIGHT–SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT–SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND PRODUCTION METHOD FOR ELECTRONIC DEVICE

WIPO Patent Application WO/2023/145564

A1

The present invention provides an active light–sensitive or radiation-sensitive resin composition that includes (A) a resin that is degraded and increases in polarity under the action of acid and (C) a compound that generates an acid as a result of being irradiated with active light or radiation, the compound being an ionic compound that has an anion portion that is represented by a specific general formula (I), and the HOMO of the acid being at least -6.50 eV. The present invention also provides an active light–sensitive or radiation-sensitive film, a pattern formation method, a production method for an electronic device, and a compound that use the active light–sensitive or radiation-sensitive resin composition.

JP2001066776	IMAGE-FORMING MATERIAL
JPH11310714	RED RESIN COMPOSITION, PHOTOSENSITIVE RED RESIN COMPOSITION, PHOTOSENSITIVE FLUID FOR FORMATION OF RED IMAGE, PRODUCTION OF COLORED IMAGE, AND PRODUCTION OF COLOR FILTER
JP2006256132	NEGATIVE TYPE PHOTOSENSITIVE LITHOGRAPHIC PRINTING PLATE MATERIAL AND PLATEMAKING METHOD FOR LITHOGRAPHIC PRINTING PLATE

MIYOSHI TARO (JP)
YAMAGUCHI SHUHEI (JP)
MOTOYAMA HIROKI (JP)

PCT/JP2023/001305

August 03, 2023

January 18, 2023

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FUJIFILM CORP (JP)

G03F7/004; C07D409/04; C07D495/04; C08F212/14; C08F220/26; G03F7/038; G03F7/039; G03F7/20

JP2021081678A	2021-05-27
JP2015131777A	2015-07-23
JP2013200560A	2013-10-03

KOH-EI, P.C. (JP)

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