Title:
ACTIVE RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/212079
Kind Code:
A1
Abstract:
Provided are: an active ray-sensitive or radiation-sensitive resin composition with which it is possible to form a pattern that is applicable as a mask having excellent crack resistance and etching resistance; a resist film; a pattern formation method; and an electronic device production method. This active ray-sensitive or radiation-sensitive resin composition contains a resin and has a solid concentration of 10 mass% or more, wherein: the resin comprises a repeat unit A derived from a monomer having a homopolymer glass transition temperature of 50°C or lower and a repeat unit B having an acid-decomposable group; the contained amount of the repeat unit B is 20 mol% or less with respect to the total amount of the repeat units in the resin; and at least one type of the repeat units in the resin has an aromatic ring.
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Inventors:
HATAKEYAMA NAOYA (JP)
YONEKUTA YASUNORI (JP)
YOSHIMURA TSUTOMU (JP)
HIGASHI KOHEI (JP)
NISHIDA YOICHI (JP)
YONEKUTA YASUNORI (JP)
YOSHIMURA TSUTOMU (JP)
HIGASHI KOHEI (JP)
NISHIDA YOICHI (JP)
Application Number:
PCT/JP2018/018239
Publication Date:
November 22, 2018
Filing Date:
May 11, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F12/12; C08F22/02; C08F22/10; G03F7/004; G03F7/20
Domestic Patent References:
| WO2017057616A1 | 2017-04-06 |
Foreign References:
| JP2014514602A | 2014-06-19 | |||
| JP2000026558A | 2000-01-25 | |||
| JP2013047765A | 2013-03-07 | |||
| JPH0539444A | 1993-02-19 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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