ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND POLYESTER

WIPO Patent Application WO/2019/187632

A1

Provided are: an active-ray-sensitive or radiation-sensitive resin composition which has such a property that an immersion liquid prepared from the composition can exhibit high followability to an exposure device during exposure to light and a film produced by the baking of the immersion liquid after the exposure to light can have high hydrophilicity even when the scanning speed employed in the exposure to light is ultrahigh, and which causes fewer development defects and has excellent LWR performance; and others. An active-ray-sensitive or radiation-sensitive resin composition comprising a resin which has a group capable of being decomposed by the action of an acid to increase the polarity thereof, a polyester which has a group capable of being decomposed with an acid, and a photo-acid generator; and an active-ray-sensitive or radiation-sensitive film, a pattern formation method, and an electronic device manufacturing method, in each of which the active-ray-sensitive or radiation-sensitive resin composition is used; and the polyester.

NOZAKI ATSUYASU (JP)

PCT/JP2019/003846

October 03, 2019

February 04, 2019

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FUJIFILM CORP (JP)

G03F7/039; C08F220/10; C08G63/00; G03F7/20; G03F7/32

JP2010237413A	2010-10-21
JP2014063148A	2014-04-10
US20080050674A1	2008-02-28
JP2007002045A	2007-01-11
JP2011219753A	2011-11-04
JP2003261657A	2003-09-19

NAKASHIMA Junko et al. (JP)

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