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Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND POLYESTER
Document Type and Number:
WIPO Patent Application WO/2019/187632
Kind Code:
A1
Abstract:
Provided are: an active-ray-sensitive or radiation-sensitive resin composition which has such a property that an immersion liquid prepared from the composition can exhibit high followability to an exposure device during exposure to light and a film produced by the baking of the immersion liquid after the exposure to light can have high hydrophilicity even when the scanning speed employed in the exposure to light is ultrahigh, and which causes fewer development defects and has excellent LWR performance; and others. An active-ray-sensitive or radiation-sensitive resin composition comprising a resin which has a group capable of being decomposed by the action of an acid to increase the polarity thereof, a polyester which has a group capable of being decomposed with an acid, and a photo-acid generator; and an active-ray-sensitive or radiation-sensitive film, a pattern formation method, and an electronic device manufacturing method, in each of which the active-ray-sensitive or radiation-sensitive resin composition is used; and the polyester.

Inventors:
NOZAKI Atsuyasu (4000 Kawashiri, Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
Application Number:
JP2019/003846
Publication Date:
October 03, 2019
Filing Date:
February 04, 2019
Export Citation:
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Assignee:
FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome Minato-k, Tokyo 20, 〒1068620, JP)
International Classes:
G03F7/039; C08F220/10; C08G63/00; G03F7/20; G03F7/32
Foreign References:
JP2010237413A2010-10-21
JP2014063148A2014-04-10
US20080050674A12008-02-28
JP2007002045A2007-01-11
JP2011219753A2011-11-04
JP2003261657A2003-09-19
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (6F FFTP M0 BLDG, 1250 Takematsu Minamiashigara-sh, Kanagawa 11, 〒2500111, JP)
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