Title:
ACTIVE RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, RESIN
Document Type and Number:
WIPO Patent Application WO/2020/004306
Kind Code:
A1
Abstract:
The present invention provides an active ray-sensitive or radiation-sensitive resin composition that is less likely to generate defects during both development processes of alkali development and organic solvent development, and also provides a pattern forming method, an electronic device manufacturing method, and a resin. The active ray-sensitive or radiation-sensitive resin composition of the present invention comprises a resin having a repeating unit represented by the formula (1) and a repeating unit having an acid-decomposable group, and a photoacid generator.
Inventors:
GOTO AKIYOSHI (JP)
KAWASHIMA TAKASHI (JP)
YAGI KAZUNARI (JP)
ASAKAWA DAISUKE (JP)
TAKADA AKIRA (JP)
KAWASHIMA TAKASHI (JP)
YAGI KAZUNARI (JP)
ASAKAWA DAISUKE (JP)
TAKADA AKIRA (JP)
Application Number:
PCT/JP2019/024899
Publication Date:
January 02, 2020
Filing Date:
June 24, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; C08F224/00; G03F7/039; G03F7/20
Foreign References:
| US20060292490A1 | 2006-12-28 | |||
| JP2016011411A | 2016-01-21 | |||
| JP2013040306A | 2013-02-28 | |||
| JPH04191751A | 1992-07-10 | |||
| JP2017058421A | 2017-03-23 | |||
| JP2018064093A | 2018-04-19 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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