ADDITION-CURABLE MOLD-RELEASING SILICONE COMPOSITION FOR SILICONE ADHESIVE

WIPO Patent Application WO/2023/228636

A1

The present invention is an addition-curable mold-releasing silicone composition that is for a silicone adhesive and that comprises: (A) a fluorine-containing organopolysiloxane which has at least two alkenyl groups bonded to a silicon atom per molecule and at least one fluorine-containing substituent bonded to a silicon atom, which has a fluorine content of 25-50 mass%, and in which in a molecular weight distribution measurement performed via gel permeation chromatography analysis, the peak area of a component having a molecular weight of not more than 4,000 is 2-20% of the total peak area; (B) an organohydrogen polysiloxane which has at least three hydrogen atoms (SiH groups) bonded to a silicon atom per molecule; (C) a platinum group metal catalyst; and (D) a non-fluorine based solvent. Thus, provided is a silicone composition for a mold releasing agent that can be diluted with a non-fluorine based solvent, that exhibits high coatability and adhesiveness with respect to a film base material, that exhibits low peeling force, and that can provide a cured coating in which there is little reduction in residual adhesion rate.

OGIKUBO SHUNYA (JP)
YASUDA HIROYUKI (JP)

PCT/JP2023/015871

November 30, 2023

April 21, 2023

Click for automatic bibliography generation  

SHINETSU CHEMICAL CO (JP)

B32B27/00; B32B27/10; B32B27/30; B32B29/00; C08K3/24; C08L83/05; C08L83/08; C09D7/20; C09D7/63; C09D183/05; C09D183/07; C09J7/40; C09J11/06; C09J183/05; C09J183/07

WO2020138417A1

2020-07-02

JP2008156563A	2008-07-10
JP2004300414A	2004-10-28
JP2016182772A	2016-10-20
JP2006519893A	2006-08-31
JP2013510921A	2013-03-28

YOSHIMIYA Mikio et al. (JP)

View/Download PDF      PDF Help

Previous Patent: SEMICONDUCTOR DEVICE AND SWITCHING POWER SUPPLY

Next Patent: HEAT TREATMENT METHOD, HEAT TREATMENT SYSTEM, AND HEAT TREATMENT DEVICE