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Title:
ADDITION-CURE SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/151033
Kind Code:
A1
Abstract:
This addition-cure silicone composition comprises (A) an organopolysiloxane that has two or more aliphatic unsaturated hydrocarbon groups per molecule and has a kinematic viscosity of 60-100,000 mm2/s at 25°C, (B) an organohydrogen polysiloxane that has two or more silicon atom-bonded hydrogen atoms per molecule, and (C) hydrosilylation catalyst particles that have a microcapsule structure in which a platinum group metal catalyst-containing organic compound or polymer compound (C') serves as a core substance, while a three-dimensional crosslinked polymer compound obtained by polymerizing at least one type of a polyfunctional monomer (C") serves as a wall substance, wherein [solubility parameter of (C")]-[solubility parameter of (C')] is at least 1.0. Since the hydrosilylation catalyst particles having a specific structure are used in this addition-curable silicone composition, it is possible to prevent the silicone composition from being cured prior to the originally intended curing process when the composition is exposed to extremely high temperature exceeding 200°C, and to maintain the activity of the hydrosilylation catalyst.

Inventors:
KITAZAWA KEITA (JP)
Application Number:
PCT/JP2018/004558
Publication Date:
August 23, 2018
Filing Date:
February 09, 2018
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; B01J31/22; B01J35/08; C08F2/44; C08K9/10; C08L83/05
Domestic Patent References:
WO2016052521A22016-04-07
Foreign References:
JPH0459873A1992-02-26
JPH07196921A1995-08-01
JPH0214244A1990-01-18
JP2002012768A2002-01-15
JPS6447442A1989-02-21
JPH0446962A1992-02-17
JPH11236508A1999-08-31
JP2014024986A2014-02-06
Other References:
"Setchaku", vol. 40, 1996, KOBUNSHI KANKOKAI, pages: 342 - 350
See also references of EP 3584285A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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