ADDITIVE ADDED TO SOLUTION FOR ELECTROLYTIC COPPER PLATING USING ANODE OF PHOSPHORATED COPPER, SOLUTION FOR ELECTROLYTIC COPPER PLATING AND METHOD OF ELECTROLYTIC COPPER PLATING

WIPO Patent Application WO/2007/086454

A1

An additive added to a solution for electrolytic copper plating using an anode of phosphorated copper, comprising at least one component selected from the group consisting of alkenes and alkynes. Further, there is provided a solution for electrolytic copper plating used to carry out electrolysis with the use of an anode of phosphorated copper, characterized in that the above additive is contained. This additive for electrolytic copper plating even when electrolytic operation is continuously carried out with the use of a solution for electrolytic copper plating using an anode of phosphorated copper is effective in not only suppression of the generation of anode sludge but also inhibition of any denaturation of brightener components.

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MATSUNAMI TAKASHI (JP)
NISHIKI SHINGO (JP)
MAEDA TAKEAKI (JP)
WATANABE HIROFUMI (JP)
YOKOHATA TAKASHI (JP)

PCT/JP2007/051152

August 02, 2007

January 25, 2007

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OKUNO CHEM IND CO (JP)
MATSUNAMI TAKASHI (JP)
NISHIKI SHINGO (JP)
MAEDA TAKEAKI (JP)
WATANABE HIROFUMI (JP)
YOKOHATA TAKASHI (JP)

C25D3/38; H01L21/288; H05K3/40

JPH11260824A	1999-09-24
JPS59200786A	1984-11-14

SAEGUSA, Eiji et al. (1-7-1 Doshomach, Chuo-ku Osaka-shi Osaka 45, JP)

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