Title:
ADDITIVE FOR COPPER ETCHING SOLUTION AND PRODUCTION METHOD FOR COPPER ETCHING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2017/219395
Kind Code:
A1
Abstract:
Disclosed are an additive for a copper etching solution and a production method for a copper etching solution. The method comprises: producing an additive for a copper etching solution, wherein the additive for a copper etching solution is an inorganic solution comprising bivalent copper ions, and the additive for a copper etching solution uses deionized water as a solvent and is electrically neutral; and before performing wet etching, adding the additive for a copper etching solution to the copper etching solution such that the concentration of the bivalent copper ions is 700-1000 ppm. By virtue of the means, the etching quality of the copper etching solution can be improved, and the etching rate and uniformity are improved.
Inventors:
WU YUE (CN)
ZHOU YOULIAN (CN)
ZHOU ZHICHAO (CN)
ZHOU YOULIAN (CN)
ZHOU ZHICHAO (CN)
Application Number:
PCT/CN2016/089681
Publication Date:
December 28, 2017
Filing Date:
July 11, 2016
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
C23F1/18
Foreign References:
| CN103060810A | 2013-04-24 | |||
| CN103695908A | 2014-04-02 | |||
| CN105039985A | 2015-11-11 | |||
| JP5866566B2 | 2016-02-17 | |||
| CN104562013A | 2015-04-29 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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