Title:
ADDITIVE FOR IMPARTING LOW HEAT BUILD-UP TO RUBBER COMPONENT
Document Type and Number:
WIPO Patent Application WO/2017/057758
Kind Code:
A1
Abstract:
Provided is an additive for imparting low heat build-up to a rubber component, wherein the additive includes a tetrazine compound represented by general formula (1): [in the formula, X1 and X2 are the same or different and represent a hydrogen atom, alkyl group, alkylthio group, aralkyl group, aryl group, arylthio group, heterocyclic group, or amino group; each of these groups may have one or more substituents] or a salt thereof.
Inventors:
SATO TAKASHI (JP)
YUASA HIROAKI (JP)
NAKASHIMA SHINYA (JP)
YUASA HIROAKI (JP)
NAKASHIMA SHINYA (JP)
Application Number:
PCT/JP2016/079170
Publication Date:
April 06, 2017
Filing Date:
September 30, 2016
Export Citation:
Assignee:
OTSUKA CHEMICAL CO LTD (JP)
International Classes:
C08L9/00; B60C1/00; C08K3/00; C08K3/04; C08K5/3477; C08L7/00; C08L9/06; C08L11/00; C08L53/02
Foreign References:
| JP2015093928A | 2015-05-18 | |||
| JPS4947439A | 1974-05-08 | |||
| JP2005200641A | 2005-07-28 | |||
| JP2009526649A | 2009-07-23 | |||
| JP2014515776A | 2014-07-03 | |||
| JPS471705B1 |
Other References:
See also references of EP 3357961A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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