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Patent Searching and Data


Title:
ADDITIVE MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/208553
Kind Code:
A1
Abstract:
The purpose of the present invention is to obtain an additive manufacturing device capable of manufacturing while reducing the flow rate of Ar gas. This additive manufacturing device is characterized in that a reduced-pressure atmosphere is maintained in a manufacturing area, an inert gas is supplied to the manufacturing area, the proportion of gaseous impurities in the manufacturing area is detected, and if the proportion of gaseous impurities exceeds a threshold value, the supply of inert gas is reduced.

Inventors:
AOTA Kinya (6-6, Marunouchi 1-chome, Chiyoda-k, Tokyo 80, 〒1008280, JP)
Application Number:
JP2017/009123
Publication Date:
December 07, 2017
Filing Date:
March 08, 2017
Export Citation:
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Assignee:
HITACHI, LTD. (6-6 Marunouchi 1-chome, Chiyoda-ku Tokyo, 80, 〒1008280, JP)
International Classes:
B22F3/16; B22F3/105; B29C64/268; B29C64/371; B29C64/393; B33Y30/00
Foreign References:
JP2016006215A2016-01-14
JP2015196856A2015-11-09
JP2016074957A2016-05-12
JP2004277878A2004-10-07
US20140271965A12014-09-18
Attorney, Agent or Firm:
HIRAKI Yusuke et al. (Atago Green Hills MORI Tower 32F, 5-1 Atago 2-chome, Minato-k, Tokyo 32, 〒1056232, JP)
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