Title:
ADDITIVE FOR PRESSURE-SENSITIVE ADHESIVE, AND THERMOSENSITIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/090992
Kind Code:
A1
Abstract:
The additive for pressure-sensitive adhesives of the present invention is a copolymer comprising an N-substituted maleimide compound and a carboxylated, ethylenically unsaturated monomer as monomer ingredients. The copolymer may contain the N-substituted maleimide compound in a higher weight proportion than the carboxylated, ethylenically unsaturated monomer. The thermosensitive pressure-sensitive adhesive composition of the present invention comprises the additive for pressure-sensitive adhesives and a polymer including crystalline side chains and shows a reduced adhesive force at temperatures lower than the melting point of the polymer including crystalline side chains.
Inventors:
YAMAGUCHI SATOSHI (JP)
Application Number:
PCT/JP2019/042864
Publication Date:
May 07, 2020
Filing Date:
October 31, 2019
Export Citation:
Assignee:
NITTA CORP (JP)
International Classes:
C09J201/00; C08F222/40; C08L35/00; C08L101/12; C09J7/38; C09J11/08; C09J133/00; C09J135/00
Foreign References:
| JP2013166910A | 2013-08-29 | |||
| JP2012102212A | 2012-05-31 | |||
| JP2012158633A | 2012-08-23 |
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
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