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Title:
ADHESION DEVICE, AND ADHESION METHOD
Document Type and Number:
WIPO Patent Application WO/2014/050484
Kind Code:
A1
Abstract:
An adhesion device (1) for adhering a substrate (2) and a support body (3) via an adhesion layer (4) is provided with support body holding members (42). Holding tools (42a) of the support body holding members (42) hold the support body (3) with the oblique surface parts (contact members (42b)) of the holding tools (42a) in a manner such that the support body (3) does not come into contact with the surface of the substrate (2) to which the support body (3) is to be adhered. The adhesion device (1) adheres, to the substrate (2), the support body (3) that is held so as to not come into contact with the surface.

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Inventors:
INAO YOSHIHIRO (JP)
KATO SHIGERU (JP)
TSUSHIMA SHUGO (JP)
KATSURAGAWA JUNICHI (JP)
KOBARI SATOSHI (JP)
NAKAMURA AKIHIKO (JP)
Application Number:
PCT/JP2013/073936
Publication Date:
April 03, 2014
Filing Date:
September 05, 2013
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
H01L21/02; H01L21/683
Foreign References:
JP2008166548A2008-07-17
JP2011040691A2011-02-24
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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