Title:
ADHESION LAYER-FORMING COMPOSITION, METHOD OF MANUFACTURING CURED PRODUCT PATTERN, METHOD OF MANUFACTURING OPTICAL COMPONENT, METHOD OF MANUFACTURING CIRCUIT BOARD, METHOD OF MANUFACTURING IMPRINTING MOLD, AND DEVICE COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/120944
Kind Code:
A1
Abstract:
An adhesion layer-forming composition contains a compound (A) containing either or both of alkoxyalkyl and alkylol groups, the number of either of the alkoxyalkyl and alkylol groups per molecule or the number of the alkoxyalkyl and alkylol groups per molecule being at least 5 in total, and a compound (B) containing at least two thiol groups per molecule.
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Inventors:
HONMA TAKESHI (JP)
ITO TOSHIKI (JP)
OTANI TOMONORI (JP)
ITO TOSHIKI (JP)
OTANI TOMONORI (JP)
Application Number:
PCT/JP2015/006471
Publication Date:
August 04, 2016
Filing Date:
December 25, 2015
Export Citation:
Assignee:
CANON KK (JP)
International Classes:
H01L21/027; B29C59/02; H05K3/06
Foreign References:
| JP2013153084A | 2013-08-08 | |||
| US20150014819A1 | 2015-01-15 | |||
| JP2012079782A | 2012-04-19 | |||
| US20130126472A1 | 2013-05-23 | |||
| US20110232515A1 | 2011-09-29 |
Attorney, Agent or Firm:
ABE, Takuma et al. (30-2Shimomaruko 3-chome, Ohta-k, Tokyo 01, JP)
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