Title:
ADHESION METHOD AND HOT-MELT ADHESIVE FILM FOR INDUCTION HEATING
Document Type and Number:
WIPO Patent Application WO/2023/176964
Kind Code:
A1
Abstract:
This adhesion method is for adhering adherend 1 formed from resin (1) and adherend 2 formed from resin (2) different from the resin (1) to each other, the method having: a step for obtaining a laminate by laminating the adherend 1, a hot-melt adhesive film for induction heating, and the adherend 2 in said order; and a step for heating the hot-melt adhesive film for induction heating by using an induction heating device. The hot-melt adhesive film for induction heating is a film in which a thermoplastic resin layer (A') formed from thermoplastic resin (A), a metal layer, and a thermoplastic resin layer (B') formed from thermoplastic resin (B) are laminated in said order; and in the laminate, the adherend 1 and the thermoplastic resin layer (A') are in contact with each other, and the adherend 2 and the thermoplastic resin layer (B') are in contact with each other.
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Inventors:
MARUYAMA YUIKO (JP)
TAKEYAMA SHUNSUKE (JP)
TAKEYAMA SHUNSUKE (JP)
Application Number:
PCT/JP2023/010600
Publication Date:
September 21, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
B32B27/00; B29C65/36; B29C65/40; B32B15/08; C09J5/00; C09J201/00
Foreign References:
| JP2013023171A | 2013-02-04 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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