Title:
ADHESION PREVENTION FILM FOR MEDICAL DEVICES AND MEDICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/145842
Kind Code:
A1
Abstract:
This adhesion prevention film for medical devices is a single-layer or multilayer adhesion prevention film that is formed on the surface of a medical device. This adhesion prevention film for medical devices comprises an outermost layer that contains a plurality of conductive particles and a resin having a continuously usable temperature of 200°C or higher. The surface of the outermost layer is provided with recesses and projections by having parts of the plurality of conductive particles exposed from the resin.
Inventors:
MURANO YU (JP)
FUJIHARA TAKUYA (JP)
DEGUCHI TAKESHI (JP)
KASAI HIROAKI (JP)
SHIRAMIZU KOHEI (JP)
FUJIHARA TAKUYA (JP)
DEGUCHI TAKESHI (JP)
KASAI HIROAKI (JP)
SHIRAMIZU KOHEI (JP)
Application Number:
PCT/JP2017/005156
Publication Date:
August 31, 2017
Filing Date:
February 13, 2017
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B18/14; A61L31/12; B26D1/00; B32B27/00; B32B27/18; H01B1/00; H01B1/24
Foreign References:
| JP2010284439A | 2010-12-24 | |||
| JP2006288425A | 2006-10-26 | |||
| JPS5691743A | 1981-07-24 | |||
| JPH1095448A | 1998-04-14 | |||
| US20040115477A1 | 2004-06-17 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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