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Title:
ADHESIVE AGENT COMPOSITION, FILM-LIKE ADHESIVE AGENT, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/184490
Kind Code:
A1
Abstract:
Disclosed is an adhesive agent composition containing a thermosetting resin, a curing agent, an elastomer, and an inorganic filler, wherein the curing agent contains a phenol resin having an alicyclic ring, and the contained amount of the elastomer is 10-80 parts by mass with respect to 100 parts by mass of the thermosetting resin. Also disclosed are: a film-like adhesive agent using such an adhesive agent composition; and an adhesive sheet and a semiconductor device manufacturing method which use such a film-like adhesive agent.

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Inventors:
HASHIMOTO SHINTARO (JP)
YAHATA TATSUYA (JP)
TANIGUCHI KOHEI (JP)
Application Number:
PCT/JP2020/009887
Publication Date:
September 17, 2020
Filing Date:
March 06, 2020
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J11/04; C09J11/08; C09J163/00; H01L21/301; H01L21/52
Domestic Patent References:
WO2008133472A12008-11-06
Foreign References:
KR20160000360A2016-01-04
JP2010265359A2010-11-25
JP2011174010A2011-09-08
JP2010118554A2010-05-27
JP2014175459A2014-09-22
JP2004059859A2004-02-26
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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