Title:
ADHESIVE AGENT COMPOSITION, FILM-LIKE ADHESIVE AGENT, SEMICONDUCTOR PACKAGE USING FILM-LIKE ADHESIVE AGENT, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/127378
Kind Code:
A1
Abstract:
The present invention provides: an adhesive agent composition containing an epoxy resin (A), an epoxy resin curing agent (B), a polyurethane resin (C), and an inorganic filler (D), wherein the polyurethane resin (C) has an elastic modulus at 25°C of at least 8.0 MPa, as measured by dynamic viscoelasticity, the proportion of the polyurethane resin (C) in the total of the respective amounts of the epoxy resin (A) and the polyurethane resin (C) is 2.0-50.0 mass%, and a film-like adhesive agent formed using the adhesive agent composition has a maximum tensile stress value of at least 7.0 MPa on a stress-strain curve when a tensile force is applied thereto; a film-like adhesive agent using the adhesive agent composition; a semiconductor package; and a method for producing the same.
Inventors:
MORITA MINORU (JP)
KAJIHARA TOMOHITO (JP)
OTANI YOTA (JP)
MARUYAMA HIROMITSU (JP)
KAJIHARA TOMOHITO (JP)
OTANI YOTA (JP)
MARUYAMA HIROMITSU (JP)
Application Number:
PCT/JP2022/044032
Publication Date:
July 06, 2023
Filing Date:
November 29, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/52; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2021002248A1 | 2021-01-07 | |||
| WO2012160916A1 | 2012-11-29 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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