Title:
ADHESIVE AGENT COMPOSITION FOR SEALING, AND PRESS-THROUGH PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/230547
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an adhesive agent composition for sealing which has excellent suitability for heat-sealing at low temperature, and excellent blocking resistance. As a result of the present inventors' diligent research, the problem is solved by the inclusion of a specific vinyl chloride-vinyl acetate copolymer (A), a filler (C), and a polyurethane resin (D) and/or a polyester resin (E). Specifically, the present invention pertains to an adhesive agent composition that is for sealing and that is characterized by containing a vinyl chloride-vinyl acetate copolymer (A) containing an acid group, a filler (C), and a polyurethane resin (D) and/or a polyester resin (E).
Inventors:
TAKESHITA NAOHIRO (JP)
ITOU YOSHIKI (JP)
TACHIBANA MARI (JP)
ITOU YOSHIKI (JP)
TACHIBANA MARI (JP)
Application Number:
PCT/JP2018/022354
Publication Date:
December 20, 2018
Filing Date:
June 12, 2018
Export Citation:
Assignee:
DIC GRAPHICS CORP (JP)
International Classes:
C09J127/06; B32B15/082; B65D75/34; C09J11/04; C09J11/08; C09J131/04; C09J167/00; C09J175/04
Foreign References:
JPS58171947A | 1983-10-08 | |||
JP2012001576A | 2012-01-05 | |||
JP2016216063A | 2016-12-22 | |||
JP2000044917A | 2000-02-15 | |||
JP2014069825A | 2014-04-21 | |||
JPS5773005A | 1982-05-07 | |||
JP2012201839A | 2012-10-22 | |||
JP2017186468A | 2017-10-12 | |||
JP2018058648A | 2018-04-12 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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