Title:
ADHESIVE AGENT COMPOSITION FOR SEMICONDUCTOR LAMINATES
Document Type and Number:
WIPO Patent Application WO/2015/046333
Kind Code:
A1
Abstract:
Provided is an adhesive agent composition for semiconductor laminates, which enables the formation of an adhesive agent layer that does not exert adhesiveness at a temperature lower than 50°C and exerts adhesiveness upon the heating to a temperature at which the damage to a semiconductor chip can be reduced when the adhesive agent composition is applied and then subjected to drying by heating, and can be cured rapidly after exerting the adhesiveness.
The adhesive agent composition for semiconductor laminates according to the present invention comprises a polymerizable compound (A), a cationic polymerization initiator (B1) and/or an anionic polymerization initiator (B2), and a solvent (C).
The polymerizable compound (A): 80% by weight or more of an epoxy compound having a softening point or melting point of 50°C or higher is contained.
The cationic polymerization initiator (B1): a composition produced by adding 1 part by weight of the cationic polymerization initiator (B1) to 100 parts by weight of 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate has a heat curing time of 3.5 minutes or longer at 130°C.
The anionic polymerization initiator (B2): a composition produced by adding 1 part by weight of the anionic polymerization initiator (B2) to 100 parts by weight of bisphenol-A diglycidyl ether has a heat curing time of 3.5 minutes of longer at 130°C.
Inventors:
TANAKA HIROKI (JP)
NAKAGUCHI KATSUHIRO (JP)
TSUTSUMI KIYOHARU (JP)
ITO YOUSUKE (JP)
TSUJI NAOKO (JP)
NAKAGUCHI KATSUHIRO (JP)
TSUTSUMI KIYOHARU (JP)
ITO YOUSUKE (JP)
TSUJI NAOKO (JP)
Application Number:
PCT/JP2014/075432
Publication Date:
April 02, 2015
Filing Date:
September 25, 2014
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C09J163/00; C09J7/35; C09J11/06; H01L23/29; H01L23/31; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2001060938A1 | 2001-08-23 |
Foreign References:
| JP2001294843A | 2001-10-23 | |||
| JP2008141114A | 2008-06-19 | |||
| JP2009120830A | 2009-06-04 | |||
| JP2001172364A | 2001-06-26 | |||
| JP2009543920A | 2009-12-10 | |||
| JP2010174077A | 2010-08-12 |
Other References:
TAKASHI KAMON ET AL.: "Sanfukka Hoso Amine Complex Oyobi Fukka Hoso San Amine-en ni yoru Epoxy Jushi no Koka", TORONKAI KOEN YOSHI, vol. 19, 1969, pages 163 - 170
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
Yukihisa Goto (JP)
Download PDF:
Previous Patent: RADIATION SENSITIVE COMPOSITION AND PATTERN FORMING METHOD
Next Patent: FILLER FOR THREE-DIMENSIONAL MOUNTING OF SEMICONDUCTOR ELEMENT
Next Patent: FILLER FOR THREE-DIMENSIONAL MOUNTING OF SEMICONDUCTOR ELEMENT