ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET CONTAINING SAME, LAYERED BODY, AND PRINTED CIRCUIT BOARD

Title:

ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET CONTAINING SAME, LAYERED BODY, AND PRINTED CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2023/167080

Kind Code:

A1

Abstract:

[Problem] To provide: an adhesive agent composition having excellent heat resistance and adhesive strength, a low dielectric constant and dielectric loss tangent, and excellent dielectric properties; an adhesive sheet containing the same; a layered body; and a printed circuit board. [Solution] Provided is an adhesive agent composition containing a polyimide resin (A) and a compound (B) having epoxy groups and terminal unsaturated hydrocarbon groups.

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Inventors:

SAKAMOTO KOICHI (JP)
KAWAKUSU TETSUO (JP)

Application Number:

PCT/JP2023/006543

Publication Date:

September 07, 2023

Filing Date:

February 22, 2023

Export Citation:

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Assignee:

TOYO BOSEKI (JP)

International Classes:

C09J179/08; C09J7/35

Domestic Patent References:

WO2010016305A1

2010-02-11

Foreign References:

JP2022031739A	2022-02-22
JP2022033144A	2022-02-28
JP7024923B1	2022-02-24

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