Title:
ADHESIVE AGENT, ADHESIVE FILM, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2014/103637
Kind Code:
A1
Abstract:
The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyimide, (b) an epoxy compound and (c) an acid-modified rosin.
Inventors:
FUJIMARU KOICHI (JP)
NONAKA TOSHIHISA (JP)
NONAKA TOSHIHISA (JP)
Application Number:
PCT/JP2013/082559
Publication Date:
July 03, 2014
Filing Date:
December 04, 2013
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C09J179/08; C09J7/00; C09J11/04; C09J163/00; C09J193/04; H01L21/60; H05K1/14; H05K3/32
Domestic Patent References:
| WO2006132165A1 | 2006-12-14 |
Foreign References:
| JP2008094870A | 2008-04-24 | |||
| JP2000144082A | 2000-05-26 | |||
| JP2006144022A | 2006-06-08 | |||
| JP2004319823A | 2004-11-11 | |||
| JP2004211064A | 2004-07-29 | |||
| JP2004319823A | 2004-11-11 | |||
| JP3995022B2 | 2007-10-24 | |||
| JP2009277818A | 2009-11-26 | |||
| JP2001219294A | 2001-08-14 | |||
| JP2005059028A | 2005-03-10 |
Other References:
See also references of EP 2940094A4
Download PDF: