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Patent Searching and Data


Title:
ADHESIVE AGENT AND METHOD FOR DISASSEMBLING ADHERED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/047046
Kind Code:
A1
Abstract:
The present invention provides an adhesive, which has good adhesive strength during operation and high reliability in terms of heat resistance, moisture resistance, and the like, and with which during disassembly disassembly can be easily performed by external stimulation. In the present invention, a compound having a cyclic structure formed from C atoms and one or more atoms selected from Ni, O and S atoms is added to an adhesive. If the cyclic compound is added, the compound does not compromise the reliability of the adhesive during use, but does increase three-dimensional strain, and the cyclic compound easily decomposes when appropriately heated. The adhesive layers are embrittled and the adhered structure is disassembled by decomposition of the cyclic compound.

Inventors:
NAMBA CHIE (JP)
OKAMOTO MASAHIDE (JP)
OKAMURA MASAYUKI (JP)
Application Number:
PCT/JP2012/071537
Publication Date:
April 04, 2013
Filing Date:
August 27, 2012
Export Citation:
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Assignee:
HITACHI LTD (JP)
NAMBA CHIE (JP)
OKAMOTO MASAHIDE (JP)
OKAMURA MASAYUKI (JP)
International Classes:
C09J201/00; C09J4/02; C09J11/06; C09J163/00
Foreign References:
JP2003147282A2003-05-21
JP2010053167A2010-03-11
JPS6330581A1988-02-09
JP2008056843A2008-03-13
Attorney, Agent or Firm:
INOUE, Manabu et al. (JP)
Manabu Inoue (JP)
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Claims: