Title:
ADHESIVE AGENT FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/059639
Kind Code:
A1
Abstract:
An adhesive agent for semiconductors according to the present invention, which comprises a thermoplastic resin, a heat-curable resin, a curing agent, and a flux compound having at least one carboxyl group, in which the flux compound has a structure such that a carbon atom located at α-position in the carboxyl group is substituted by at least one electron-withdrawing group.
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Inventors:
AKIYOSHI TOSHIYASU (JP)
KAWAMATA RYUTA (JP)
KAWAMATA RYUTA (JP)
Application Number:
PCT/JP2021/033516
Publication Date:
March 24, 2022
Filing Date:
September 13, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/29; H01L21/60; H01L23/31
Domestic Patent References:
| WO2012153846A1 | 2012-11-15 | |||
| WO2018235854A1 | 2018-12-27 | |||
| WO2012053589A1 | 2012-04-26 |
Foreign References:
| JP2019173023A | 2019-10-10 | |||
| JP2004179552A | 2004-06-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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