Title:
ADHESIVE AGENT, ADHESIVE SHEET, AND PROCESS FOR PRODUCTION OF ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2010/131616
Kind Code:
A1
Abstract:
In conventional adhesive sheets in each of which a die-attach film is laminated thereon, the die-attach film is often detached from die chips when a wafer is diced to form the die chips and picking up the die chips.
Disclosed is an adhesive agent comprising a (meth) acrylic acid ester polymer, an urethane acrylate oligomer having four or more vinyl groups, and silicone microparticles. Also disclosed is a process for producing an electronic component, which comprises: a wafer bonding step of bonding a wafer onto the surface of a die-attach film of an adhesive sheet; a dicing step of dicing the wafer to produce die chips; and a pick-up step of, subsequent to the dicing step, removing the die-attach film and the adhesive layer and picking up the die chips in such a state that the die-attach film remains adhered on the die chips.
Inventors:
KAWATA SATORU (JP)
SAITO TAKESHI (JP)
SAITO TAKESHI (JP)
Application Number:
PCT/JP2010/057861
Publication Date:
November 18, 2010
Filing Date:
May 10, 2010
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
KAWATA SATORU (JP)
SAITO TAKESHI (JP)
KAWATA SATORU (JP)
SAITO TAKESHI (JP)
International Classes:
C09J133/04; C09J7/02; C09J151/08; C09J175/16; C09J183/04; H01L21/301; H01L21/52
Domestic Patent References:
| WO2009050785A1 | 2009-04-23 |
Foreign References:
| JP2008001817A | 2008-01-10 | |||
| JP2008124141A | 2008-05-29 | |||
| JP2001207154A | 2001-07-31 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
SK patent business corporation (JP)
SK patent business corporation (JP)
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Claims: