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Patent Searching and Data


Title:
ADHESIVE ATTACHMENT ASSEMBLY WITH HEAT SOURCE
Document Type and Number:
WIPO Patent Application WO2004053010
Kind Code:
A3
Abstract:
An adhesive attachment assembly is provided for mounting an attachment member such as a threaded stud or the like onto a substrate, wherein the attachment assembly includes a heat source (18) for rapidly curing a selected adhesive bonding agent (16). The adhesive attachment assembly includes a first attachment component defining a base surface (24) for receiving the curable bonding agent thereon (16), and a second attachment component (28) adapted for temporary connection to the substrate. Upon pressed mounting of the first attachment component with bonding agent (16) thereon onto the substrate, the second attachment component (28) is movable into temporary engagement with the substrate, and a spring member reacts between the first and second (28) attachment components to apply a positive force urging the first attachment component toward the substrate for the duration of the bonding agent cure time.

Inventors:
HUTTER CHARLES G III
Application Number:
US0336694W
Publication Date:
September 15, 2005
Filing Date:
November 13, 2003
Export Citation:
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Assignee:
PHYSICAL SYSTEMS, INC.
International Classes:
B29C65/34; B29C65/78; F16B11/00; F16B37/04; (IPC1-7): H05B1/00; H05B11/00; H05B3/06; H05B3/30; B32B7/12; B32B31/20; B32B31/26
Foreign References:
US3719792A1973-03-06
US4778702A1988-10-18
US4822656A1989-04-18
US4338151A1982-07-06
US4302492A1981-11-24
Other References:
See also references of EP 1587891A2
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