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Patent Searching and Data


Title:
ADHESIVE ATTACHMENT WITH ELECTRICAL GROUND
Document Type and Number:
WIPO Patent Application WO2006007357
Kind Code:
A3
Abstract:
An adhesive attachment (26) is provided for securely mounting an attachment component (20) such as a threaded stud (20) or the like on the surface of a selected substrate, wherein the adhesive attachment (26) provides an electrically conductive ground path for grounding the attachment component and/or a selected structure mounted thereto to the substrate. In one preferred form, the attachment component is a threaded element (20) such as a stud or nut. Upon mounting of the attachment component on the substrate and subsequent connection of the threaded element to a mating threaded member, e.g., of the selected structure to be mounted onto the attachment component, a conductive ground pin (18) is pressed into electrical contact with the substrate for grounding the attachment component and/or the selected structure mounted thereto.

Inventors:
HUTTER CHARLES G III (US)
Application Number:
PCT/US2005/020368
Publication Date:
September 14, 2006
Filing Date:
June 08, 2005
Export Citation:
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Assignee:
PHYSICAL SYSTEMS (US)
International Classes:
B23B3/24; H01L27/10; H01R4/04; H01R4/64; H05K5/02; H01R4/24
Foreign References:
US3308415A1967-03-07
US4541684A1985-09-17
US4778702A1988-10-18
Other References:
See also references of EP 1765538A4
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