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Patent Searching and Data


Title:
ADHESIVE BONDING DEVICE, CONTROL PROGRAM, AND ADHESIVE BODY MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/136045
Kind Code:
A1
Abstract:
In this adhesive bonding device, a mixing device mixes a main agent and a hardener agent using a stirring impeller to form an adhesive agent (530) inside a mixing container. A pressing device (200a) causes a first member (610) to which the adhesive agent (530) discharged from the mixing container is attached to face a second member (620) via the adhesive agent (530), and presses either the first member (610) or the second member (620) against the other. A detector detects the torque of the rotation of the stirring impeller or a physical quantity representing the torque when the main agent and the hardener agent are mixed using the stirring impeller or when the adhesive agent already formed is kneaded again using the stirring impeller. A control device (300) controls the magnitude of force and/or the time length of the pressing performed by the pressing device (200a), according to the value of the torque or the physical quantity detected by the detector.

Inventors:
NISHIMURA YOSHITOMO (JP)
Application Number:
PCT/JP2022/046434
Publication Date:
July 20, 2023
Filing Date:
December 16, 2022
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B05C5/00; B01F23/47; B01F35/71; B05C9/12; B05C11/10; C09J5/00; C09J201/00
Domestic Patent References:
WO2012131110A22012-10-04
Foreign References:
JP2011528057A2011-11-10
JP2001149838A2001-06-05
JP2002126593A2002-05-08
US20040000203A12004-01-01
JP2021166966A2021-10-21
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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