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Title:
ADHESIVE FOR BONDING TO LOW SURFACE ENERGY SURFACES
Document Type and Number:
WIPO Patent Application WO2001057151
Kind Code:
A3
Abstract:
A novel polymodal asymmetric elastomeric block copolymer and a pressure sensitive adhesive, tape and adhesive backed article made therefrom, such as a polymer foam article having a substantially smooth surface prepared by melt-mixing a polymer composition and a plurality of microspheres, at least one of which is an expandable polymeric microsphere, under process conditions, including temperature and shear rate, selected to form an expandable extrudable composition; and extruding the composition through a die.

Inventors:
KHANDPUR ASHISH K
MA JINGJING
GEHLSEN MARK D
MOMCHILOVICH BRADLEY S
STRADINGER JOHN J
Application Number:
PCT/US2001/002976
Publication Date:
January 17, 2002
Filing Date:
January 30, 2001
Export Citation:
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Assignee:
3M INNOVATIVE PROPERTIES CO (US)
International Classes:
B32B5/18; C08F297/04; C09J7/26; C09J151/00; C09J153/02; (IPC1-7): C09J153/00; C09J153/02; C08J297/04; C09J7/02
Domestic Patent References:
WO1994017115A11994-08-04
Foreign References:
US4444953A1984-04-24
US5777039A1998-07-07
EP0316601A21989-05-24
US5693425A1997-12-02
EP0706547A11996-04-17
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