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Patent Searching and Data


Title:
ADHESIVE COATING DEVICE AND ADHESIVE COATING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/168022
Kind Code:
A1
Abstract:
Provided are an adhesive coating device and an adhesive coating method which are for a layered iron core and which make it possible to stably coat an adhesive regardless of the transfer speed of a strip-like thin steel plate to be punched, and which contribute to an improvement in productivity of the layered iron core. The adhesive coating device has an adhesive discharging part which comprises discharge holes (18) for discharging the adhesive towards an adhesive coating surface of the strip-like thin steel plate, an adhesive container (8) for housing the adhesive discharging part, and a tank (7) for supplying the adhesive at a prescribed pressure to the adhesive discharging part. The adhesive discharging part is fixed to the adhesive container (8), and on the occasion of the lower surface of the strip-like thin steel plate (2) being brought into contact with the upper surface of the adhesive container (8) when the strip-like thin steel plate (2) is to be punched into a prescribed shape, the adhesive is supplied from the tank (7), discharged from the discharge holes (18) at a fixed distance from the upper surface of the adhesive container (8) which is contacting the lower surface of the strip-like thin steel plate (2), and then the adhesive is applied onto the lower surface of the strip-like thin steel plate (2).

Inventors:
KUROSAKI Eiichi (7-10, Shinjohonmachi 2-chome, Toyama-sh, Toyama 96, 〒9300996, JP)
Application Number:
JP2019/007538
Publication Date:
September 06, 2019
Filing Date:
February 27, 2019
Export Citation:
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Assignee:
TANAKA SEIMITSU KOGYO CO., LTD. (7-10, Shinjohonmachi 2-chome Toyama-sh, Toyama 96, 〒9300996, JP)
International Classes:
H02K15/02; B05C5/00; B05C11/10; B05C13/02; B05D1/26; B05D3/00; B05D7/14; B05D7/24
Attorney, Agent or Firm:
IWATANI Ryo (KEIHAN Dojima Bldg. 6F, 1-31 Dojima 2-chome, Kita-ku, Osaka-sh, Osaka 03, 〒5300003, JP)
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