Title:
ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/010252
Kind Code:
A1
Abstract:
The present invention relates to: an adhesive composition containing a cycloaliphatic epoxy resin, of which the heating peak temperature by thermal differential scanning calorimetry is 60°C to 105°C, a cationic polymerization catalyst of chemical formula 1, and a compound of chemical formula 2; an anisotropic conductive film using the same; and a semiconductor device connected by the anisotropic conductive film.
Inventors:
PARK KYOUNG SOO (KR)
KIM JI YEON (KR)
PARK YOUNG WOO (KR)
SON BYEONG GEUN (KR)
SHIN KYOUNG HUN (KR)
SHIN YOUNG JU (KR)
JUNG KWANG JIN (KR)
HAN JAE SUN (KR)
HWANG JA YOUNG (KR)
KIM JI YEON (KR)
PARK YOUNG WOO (KR)
SON BYEONG GEUN (KR)
SHIN KYOUNG HUN (KR)
SHIN YOUNG JU (KR)
JUNG KWANG JIN (KR)
HAN JAE SUN (KR)
HWANG JA YOUNG (KR)
Application Number:
PCT/KR2015/005141
Publication Date:
January 21, 2016
Filing Date:
May 22, 2015
Export Citation:
Assignee:
SAMSUNG SDI CO LTD (KR)
International Classes:
C09J163/00; C09J7/20; C09J11/06; H01B5/14
Foreign References:
| US20030152862A1 | 2003-08-14 | |||
| KR20130057151A | 2013-05-31 | |||
| KR20130041121A | 2013-04-24 | |||
| JP2003082318A | 2003-03-19 | |||
| KR20110091864A | 2011-08-16 |
Attorney, Agent or Firm:
AIP PATENT & LAW FIRM (KR)
특허법인에이아이피 (KR)
특허법인에이아이피 (KR)
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