Title:
ADHESIVE COMPOSITION, BONDED BODY AND METHOD FOR PRODUCING ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/210166
Kind Code:
A1
Abstract:
An adhesive composition which contains a polymerizable monomer that has a (meth)acryloyl group, a radical polymerization initiator and polymer particles that are swellable with an organic solvent, wherein with respect to the particle size distribution of secondary particles, which are aggregates of the polymer particles, in the adhesive composition as determined by a laser diffraction/scattering method, the proportion of the secondary particles having a diameter of 1 μm to 200 μm is 30% by volume or more.
Inventors:
TAKAHASHI YUSUKE (JP)
TAKANO CHIAKI (JP)
KURIMURA HIROYUKI (JP)
TAKANO CHIAKI (JP)
KURIMURA HIROYUKI (JP)
Application Number:
PCT/JP2022/013513
Publication Date:
October 06, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08F285/00; C09J4/02; C09J11/06; C09J11/08
Domestic Patent References:
| WO2020110911A1 | 2020-06-04 | |||
| WO2007046190A1 | 2007-04-26 | |||
| WO2017170957A1 | 2017-10-05 | |||
| WO2005028546A1 | 2005-03-31 |
Foreign References:
| JPH04226579A | 1992-08-17 | |||
| JP2009519368A | 2009-05-14 | |||
| JP2020527621A | 2020-09-10 | |||
| JP2016155892A | 2016-09-01 | |||
| JP4707320B2 | 2011-06-22 | |||
| JP2016104834A | 2016-06-09 | |||
| JP2021059627A | 2021-04-15 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF:
Previous Patent: POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
Next Patent: CONTROL SYSTEM, PROCESSING DEVICE, AND CONTROL METHOD
Next Patent: CONTROL SYSTEM, PROCESSING DEVICE, AND CONTROL METHOD