Title:
ADHESIVE COMPOSITION AND BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/049931
Kind Code:
A1
Abstract:
The present invention provides an adhesive composition which contains (A) a poly(meth)acrylic polymer having a reactive silyl group, (B) an oxyalkylene polymer having a reactive silyl group at an end, and (C) a silane coupling agent, and which exhibits both good workability and good thermal shock resistance by containing (C-i) a secondary amino group-containing silane coupling agent as the silane coupling agent (C).
Inventors:
SAKANE DAICHIRO (JP)
YANAGISAWA SHOHEI (JP)
YANAGISAWA SHOHEI (JP)
Application Number:
PCT/JP2021/027831
Publication Date:
March 10, 2022
Filing Date:
July 28, 2021
Export Citation:
Assignee:
SUNSTAR ENGINEERING INC (JP)
International Classes:
C09J11/06; C09J133/06; C09J171/02
Domestic Patent References:
WO2014024963A1 | 2014-02-13 | |||
WO2014157247A1 | 2014-10-02 | |||
WO2017099154A1 | 2017-06-15 |
Foreign References:
JP2013241578A | 2013-12-05 | |||
JP2007269935A | 2007-10-18 | |||
JP2014088481A | 2014-05-15 | |||
JP2017214541A | 2017-12-07 | |||
JP2012102154A | 2012-05-31 | |||
JP2012056976A | 2012-03-22 | |||
JP2016210879A | 2016-12-15 | |||
JP4829107B2 | 2011-12-07 | |||
JP2005336401A | 2005-12-08 | |||
JP2014501237A | 2014-01-20 |
Other References:
See also references of EP 4098713A4
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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