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Title:
ADHESIVE COMPOSITION, BONDING FILM, LAMINATE WITH ADHESIVE COMPOSITION LAYER, LAMINATE, AND ELECTROMAGNETIC WAVE SHIELD FILM
Document Type and Number:
WIPO Patent Application WO/2024/009969
Kind Code:
A1
Abstract:
This adhesive composition includes: a polyester polyamide resin (A) that has a polyester portion and a polyamide portion; and an epoxy resin (B). There are 1–60 parts by mass of the epoxy resin (B) per 100 parts by mass of the polyester polyamide resin (A).

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Inventors:
ANDO MASARU (JP)
TORII MASAHIRO (JP)
IWATA AI (JP)
HIRAKAWA MAKOTO (JP)
Application Number:
PCT/JP2023/024689
Publication Date:
January 11, 2024
Filing Date:
July 03, 2023
Export Citation:
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Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J177/12; C09J11/04; C09J11/06; C09J163/00; C09J175/04
Domestic Patent References:
WO2016001949A12016-01-07
WO2012011265A12012-01-26
WO2022085563A12022-04-28
Foreign References:
JP2001354938A2001-12-25
CN103923585A2014-07-16
JP2009001793A2009-01-08
JPH10338807A1998-12-22
JP2015228457A2015-12-17
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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