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Patent Searching and Data


Title:
ADHESIVE COMPOSITION, BONDING METHOD, LAMINATE AND TIRE
Document Type and Number:
WIPO Patent Application WO/2010/119685
Kind Code:
A1
Abstract:
Disclosed are: an adhesive composition which can bond a film to an unvulcanized rubber strongly, and is flexible and rarely undergoes cracking under low temperature conditions; a method for bonding a film to an unvulcanized rubber using the adhesive composition; a laminate formed by the bonding method; and a tire produced using the laminate. The adhesive composition contains a polymer component which has a glass transition temperature or both a glass transition temperature and a melting point of 40°C or lower, has a main chain skeleton having a random structure, has an epoxy group, and has a sulfure-corsslinkable site. The bonding method is characterized by using the adhesive composition.

Inventors:
TAKAHASHI YUWA (JP)
NOHARA DAISUKE (JP)
NAKAGAWA DAISUKE (JP)
Application Number:
PCT/JP2010/002725
Publication Date:
October 21, 2010
Filing Date:
April 14, 2010
Export Citation:
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Assignee:
BRIDGESTONE CORP (JP)
TAKAHASHI YUWA (JP)
NOHARA DAISUKE (JP)
NAKAGAWA DAISUKE (JP)
International Classes:
B29C35/02; C09J163/00; B29D30/08; B60C1/00; C09J5/06; C09J201/06
Foreign References:
JP2005247954A2005-09-15
JPH09316414A1997-12-09
JPH1135702A1999-02-09
JPS6339975A1988-02-20
JP2009007408A2009-01-15
JPS63234075A1988-09-29
JPH023724A1990-01-09
GB2223019A1990-03-28
JPH0753932A1995-02-28
JP2006224854A2006-08-31
Other References:
See also references of EP 2420545A4
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
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