Title:
ADHESIVE COMPOSITION, BONDING SHEET, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/125778
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition which contains (A) a thermoplastic resin that has a weight average molecular weight of 10,000-150,000 and a viscosity at 25˚C of 5-300 poises as dissolved in N-methyl-2-pyrrolidone such that the resin content is 25% by mass and (B) a thermosetting component. The thermosetting component (B) contains (B1) a reactive plasticizer having an allyl group or an epoxy group, (B2) a compound having a styryl group and (B3) a compound having a maleimide group.
Inventors:
MASUKO TAKASHI (JP)
Application Number:
PCT/JP2011/058092
Publication Date:
October 13, 2011
Filing Date:
March 30, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
MASUKO TAKASHI (JP)
MASUKO TAKASHI (JP)
International Classes:
C09J201/00; C09J7/22; C09J7/30; C09J11/04; C09J11/06; C09J133/08; C09J133/14; C09J163/00; C09J179/04; H01L21/301; H01L21/52
Domestic Patent References:
| WO2010016305A1 | 2010-02-11 |
Foreign References:
| JP2008195944A | 2008-08-28 | |||
| JPH05295265A | 1993-11-09 | |||
| JP2005075866A | 2005-03-24 | |||
| JP2007262191A | 2007-10-11 | |||
| JP2004168848A | 2004-06-17 | |||
| JP2004087638A | 2004-03-18 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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Claims: