ADHESIVE COMPOSITION AND BONDING SHEET USING SAME

Title:

ADHESIVE COMPOSITION AND BONDING SHEET USING SAME

Document Type and Number:

WIPO Patent Application WO/2014/103040

Kind Code:

A1

Abstract:

Provided is an adhesive composition which is capable of bonding a metal with a metal, a metal with an organic material, and an organic material with an organic material, while having toughness. This adhesive composition is capable of maintaining excellent bonding strength even in a high temperature environment. This adhesive composition contains an epoxy resin, an acrylic resin and a curing agent, and is characterized in that the acrylic resin is formed of a (methyl methacrylate)-(butyl acrylate)-(methyl methacrylate) triblock copolymer or a modified product thereof.

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Inventors:

HOSHI KENTARO (JP)
KUROKI JUNICHI (JP)
TANIGUCHI TAKAHISA (JP)

Application Number:

PCT/JP2012/084164

Publication Date:

July 03, 2014

Filing Date:

December 28, 2012

Export Citation:

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Assignee:

DAINIPPON PRINTING CO LTD (JP)
HOSHI KENTARO (JP)
KUROKI JUNICHI (JP)
TANIGUCHI TAKAHISA (JP)

International Classes:

C09J163/00; C09J5/06; C09J7/10; C09J133/08; C09J153/00

Domestic Patent References:

WO2009101961A1	2009-08-20
WO2012039456A1	2012-03-29

Foreign References:

JP2009501258A	2009-01-15
JP2012528205A	2012-11-12
JP2013006974A	2013-01-10
JPS61188478A	1986-08-22
JPH03143980A	1991-06-19
JP2003226856A	2003-08-15
JP2009172919A	2009-08-06
JP2003082034A	2003-03-19

Other References: