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Title:
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER
Document Type and Number:
WIPO Patent Application WO/2007/074652
Kind Code:
A1
Abstract:
Provided is an adhesive composition which contains an adhesive ingredient, conductive particles and insulating particles. The ratio (Ri/Rc) of the average particle diameter (Ri) of the insulating particle to the average particle diameter (Rc) of the conductive particle is 120-300%.

Inventors:
TATSUZAWA TAKASHI (JP)
KOBAYASHI KOUJI (JP)
FUJINAWA TOHRU (JP)
FUKUSHIMA NAOKI (JP)
Application Number:
PCT/JP2006/324929
Publication Date:
July 05, 2007
Filing Date:
December 14, 2006
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
TATSUZAWA TAKASHI (JP)
KOBAYASHI KOUJI (JP)
FUJINAWA TOHRU (JP)
FUKUSHIMA NAOKI (JP)
International Classes:
C09J201/00; C09J7/00; H01B1/22; H01L21/60; H05K1/14
Foreign References:
JPH11265910A1999-09-28
JP2001271053A2001-10-02
JPH11345517A1999-12-14
JPH1187415A1999-03-30
JPH01118580A1989-05-11
JPH04253109A1992-09-08
JPH11265910A1999-09-28
JPS59120436A1984-07-12
JPS60191228A1985-09-28
JPH01251787A1989-10-06
JPH0790237A1995-04-04
JPS5120941A1976-02-19
JPH0329207A1991-02-07
JPH04174980A1992-06-23
JP3048197B22000-06-05
JP3477367B22003-12-10
Other References:
See also references of EP 1967564A4
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (Ginza First Bldg. 10-6, Ginza 1-chom, Chuo-ku Tokyo 61, JP)
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