ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION, AND STRUCTURE

Title:

ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION, AND STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2017/090659

Kind Code:

A1

Abstract:

This adhesive composition for circuit connection contains (A) a radical-polymerizable compound, (B) a radical generator, and (C) particles including at least one type of metal compound selected from the group consisting of metal hydroxides and metal oxides. The metal compound includes at least one element selected from the group consisting of aluminum, magnesium, zirconium, bismuth, calcium, tin, manganese, antimony, silicon, and titanium.

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Inventors:

MORIJIRI TOMOKI (JP)
MATSUDA KAZUYA (JP)
TANAKA MASARU (JP)
TATSUZAWA TAKASHI (JP)
SHINOHARA KENGO (JP)
KAWABATA YASUNORI (JP)

Application Number:

PCT/JP2016/084747

Publication Date:

June 01, 2017

Filing Date:

November 24, 2016

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

C09J4/00; C09J7/00; C09J9/02; C09J11/04; H01B1/22; H01L21/60; H05K1/14; H05K3/32

Foreign References:

JP2014024949A	2014-02-06
JP2015166406A	2015-09-24
JP2014074139A	2014-04-24
JP2015005435A	2015-01-08

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

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