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Title:
ADHESIVE COMPOSITION FOR CONDUCTIVE MEMBERS
Document Type and Number:
WIPO Patent Application WO/2017/014269
Kind Code:
A1
Abstract:
Provided is an adhesive composition for conductive members, which is capable of preventing oxidation degradation of a bonded member in cases where a conductive member such as an ITO film is bonded thereby, even if the adhesive composition contains an acidic component such as a carboxyl group. Proposed is an adhesive composition for conductive members, which contains a (meth)acrylic copolymer having a mass average molecular weight of from 100,000 to 1,500,000, and which is characterized in that: the (meth)acrylic copolymer has a composition containing 1.2-15% by mass of a (meth)acrylate or vinyl monomer that contains a carboxyl group; and from 1 × 10-4 to 8 × 10-1 part by mass of a phosphite ester compound is contained per 100 parts by mass of the (meth)acrylic copolymer.

Inventors:
NIIMI KAHORU (JP)
INENAGA MAKOTO (JP)
Application Number:
PCT/JP2016/071417
Publication Date:
January 26, 2017
Filing Date:
July 21, 2016
Export Citation:
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Assignee:
MITSUBISHI PLASTICS INC (JP)
International Classes:
C09J133/04; C09J7/10; C09J11/06; C09J133/06; G02F1/1333
Domestic Patent References:
WO2014065350A12014-05-01
WO2014092186A12014-06-19
WO2015045758A12015-04-02
Foreign References:
JP2014075115A2014-04-24
JP2012136557A2012-07-19
JP5952470B12016-07-13
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
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