Title:
ADHESIVE COMPOSITION AND CONNECTED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/171253
Kind Code:
A1
Abstract:
An adhesive composition which contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator and (d) a complex containing boron, and wherein (d) the complex containing boron is a compound represented by general formula (A).
(In formula (A), each of R1, R2 and R3 independently represents a hydrogen atom, an alkyl group having 1-18 carbon atoms or an aryl group; and each of R4, R5 and R6 independently represents a hydrogen atom or a specific organic group.)
Inventors:
IZAWA HIROYUKI (JP)
MORIJIRI TOMOKI (JP)
TATSUZAWA TAKASHI (JP)
MORIJIRI TOMOKI (JP)
TATSUZAWA TAKASHI (JP)
Application Number:
PCT/JP2016/062766
Publication Date:
October 27, 2016
Filing Date:
April 22, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C08F2/44; C09J4/00; C09J9/02; C09J11/06; H01L31/05
Foreign References:
| JP2013144792A | 2013-07-25 | |||
| JPH0693235A | 1994-04-05 | |||
| JPH11504625A | 1999-04-27 | |||
| JP2008518082A | 2008-05-29 | |||
| JP2013144793A | 2013-07-25 | |||
| JP2000504353A | 2000-04-11 | |||
| JP2014170794A | 2014-09-18 | |||
| JP2015007182A | 2015-01-15 | |||
| JP2009519368A | 2009-05-14 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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