Title:
ADHESIVE COMPOSITION, CONNECTION STRUCTURE, CONNECTION STRUCTURE MANUFACTURING METHOD AND APPLICATION OF ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/014562
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface, wherein the first and/or the second circuit members are configured from a substrate containing a thermoplastic resin with a glass transition temperature of 200C or less. The disclosed adhesive composition contains (a) a thermoplastic resin, (b) a radical-polymerizable compound, and (c) a radical polymerization initiator, wherein (b) the radical-polymerizable compound contains urethane (meth)acrylate having a critical surface tension of 25-40 mN/m.
Inventors:
IZAWA HIROYUKI (JP)
KATOGI SHIGEKI (JP)
KATOGI SHIGEKI (JP)
Application Number:
PCT/JP2011/062417
Publication Date:
February 02, 2012
Filing Date:
May 30, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
IZAWA HIROYUKI (JP)
KATOGI SHIGEKI (JP)
IZAWA HIROYUKI (JP)
KATOGI SHIGEKI (JP)
International Classes:
C09J201/00; C09J4/02; C09J9/02; C09J175/14; H01B1/22; H01B5/16; H01L21/60; H01R11/01
Domestic Patent References:
| WO2008139996A1 | 2008-11-20 |
Foreign References:
| JP2010153882A | 2010-07-08 | |||
| JP2009277682A | 2009-11-26 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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